Semiconductor Landing Page

Full Production Lifecycle Solutions

Front-end through back-end applications

Scroll horizontally within the table below to reveal more information.

Application	Measuring Challenge	Solution
Front End
Wafer Manufacture	A/N Mark width, position, dot diameter, depth Ingot Diameter	Automated Optical Inspection (AOI) Measure A/N mark width, position, dot diameter, and depth Measure high speed with Stream option Sub-micron accuracy Laser Scan Micrometer Measure the ingot diameter Non-contact (no scratches, no abrasions) Micron level accuracy
Flattening	Wafer thickness, back surface roughness, groove width, depth, pitch, roughness, scratches and other wafer surface defects	Automated Optical Inspection (AOI) Inspect the wafer for scratches and other defects AI Inspect uses machine learning to learn what a defect is Digital Measuring Gage Measure the wafer thickness Extremely light force (0.01N) Submicron accuracy Linear Encoder Incorporated into CVD machine Nanometer resolution 8,000 mm/s response speed Surface Roughness Measuring System Measure the wafer roughness Micron level accuracy High speed, 80 mm/s
Etching	CVD Equipment Parts: flatness, form analysis, roughness	Automated Optical Inspection (AOI) Measure the CVD plate hole locations and diameters Stream can measure the holes very quickly AI Inspect or DDPak can check for debris in the holes Linear Encoder Incorporated into CVD machine Nanometer resolution 8,000 mm/s response speed
VIA Cuts	Hole diameter and position	Automated Optical Inspection (AOI) Measure the hold diameters and depth Optional NIR to see through the substrate QV Apex with Stream Inspect VIA hole diameters Detect defects in VIA holes
Metallization	Etching: electrostatic chuck, silicone ring flatness, cross section, roughness, showerhead nozzle diameter, roundness, position Sputtering	Automated Optical Inspection (AOI) Measure the CVD plate hole locations and diameters, and measure sputtering targets AI Inspect or DDPak can check for debris in the holes AI Inspect can measure the CVD plate surface for scratches Coordinate Measuring Machine (CMM) Measure CVD, electrostatic chuck, and silicone ring for flatness World’s most accurate CMM Contour Measuring System Measure CVD, electrostatic chuck, and silicone ring for surface roughness Micron level accuracy High speed, 80 mm/s
Die Sorting	Probe card, IC test socket Wafer probe, Probe needle	Automated Optical Inspection (AOI) Measure the probe card hole diameters and positions Measure high speed with Stream option Micron level accuracy Microscope Measure the probe needle High resolution High quality, high NA optic Profile Projector Measure the probe needle Easy to use Low cost of ownership
Back End
Dicing	Cross-section observation, chip thickness, post-dicing back surface burr height	Automated Optical Inspection (AOI) Measure the burr after dicing Sub-micron accuracy WLI generates a point cloud of tens of thousands of points Microscope Measure the cross section of the diced IC High resolution High quality, high NA optic Ultra High Accuracy Linear Gage Probe Measure the IC thickness 0.1 micron accuracy
Bonding	Lead frame width, pitch, height, twisting Wire loop height	Automated Optical Inspection (AOI) Measure lead frame width, pitch, height, twist Micron level accuracy Measure wire loop height Sub-micron accuracy WLI generates a point cloud of tens of thousands of points Microscope Measure lead frame width, pitch, height, twist High resolution High quality, high NA optics
Packaging	Lead width, pitch, height variation, gap Solder ball height, diameter, pitch, coplanarity	QV Hyper with WLI Measure the hold diameters and depth Optional NIR to see through the substrate Automated Optical Inspection (AOI) Measure lead with, pitch, and height Micron level accuracy Measure solder ball height, diameter, pitch, coplanarity Micron level accuracy CPS measures Z points using a chromatic position sensor Microscope Measure the test socket pin height High resolution High quality, high NA optics Laser Scan Micrometer Measure lead width, pitch, gap Non-contact (no scratches, no abrasions) Micron level accuracy

Front End

A/N Mark width, position, dot diameter, depth

Ingot Diameter

Automated Optical Inspection (AOI)

Measure A/N mark width, position, dot diameter, and depth
Measure high speed with Stream option
Sub-micron accuracy

Laser Scan Micrometer

Measure the ingot diameter
Non-contact (no scratches, no abrasions)
Micron level accuracy

Wafer thickness, back surface roughness, groove width, depth, pitch, roughness, scratches and other wafer surface defects

Automated Optical Inspection (AOI)

Inspect the wafer for scratches and other defects
AI Inspect uses machine learning to learn what a defect is

Digital Measuring Gage

Measure the wafer thickness
Extremely light force (0.01N)
Submicron accuracy

Linear Encoder

Incorporated into CVD machine
Nanometer resolution 8,000 mm/s response speed

Surface Roughness Measuring System

Measure the wafer roughness
Micron level accuracy
High speed, 80 mm/s

CVD Equipment Parts: flatness, form analysis, roughness

Automated Optical Inspection (AOI)

Measure the CVD plate hole locations and diameters
Stream can measure the holes very quickly
AI Inspect or DDPak can check for debris in the holes

Linear Encoder

Incorporated into CVD machine
Nanometer resolution 8,000 mm/s response speed

Hole diameter and position

Automated Optical Inspection (AOI)

Measure the hold diameters and depth
Optional NIR to see through the substrate

QV Apex with Stream

Inspect VIA hole diameters
Detect defects in VIA holes

Etching: electrostatic chuck, silicone ring flatness, cross section, roughness, showerhead nozzle diameter, roundness, position

Sputtering

Automated Optical Inspection (AOI)

Measure the CVD plate hole locations and diameters, and measure sputtering targets
AI Inspect or DDPak can check for debris in the holes
AI Inspect can measure the CVD plate surface for scratches

Coordinate Measuring Machine (CMM)